Injection molding technology
Injection molding is a packaging method for traditional semiconductor electronic devices. It is a resin encapsulation method that fills the melt-shaped resin into the cavity to make it hardened.
Resin injection is an environmentally friendly process that can replace the open mold process. Resin injection process can be used to produce stable high-quality products, such as yachts and wind blades. The process can be used to produce large, complex products, but also the sandwich material or embedded parts together.
This process impregnates a dry, reinforced layer of material with the reinforcement in a rigid, airtight mold that is covered with a flexible vacuum bag and sealed along the perimeter. Using the vacuum, the resin is drawn into the mold cavity and impregnated with a reinforcing material. After the resin is cured, the vacuum bag is removed and the product can be demolded.
Compression molding technology
With the development of big data terminals such as IoT (Internet of Things) and auto-driving, the demand for semiconductor electronic components has soared, and electronic devices used in tablet PCs and smartphones have also become increasingly diversified.
At the same time require semiconductor packaging technology to ultra-thin, high-density direction, looking forward to a substrate-less wafer-level packaging process to improve production efficiency and cut the costs.
Resin utilization of 100%, can reduce material costs
Compression molding technology means pouring the liquid resin or granular into the cavity, immersing the product into the molten resin, by which the mold would be formed. This method eliminates the need for gate and runners for injection molding. With resin utilization of almost 100%, it significantly reduces customer material costs while reducing waste emissions, making it an eco-friendly forming technology.
No resin flowing, use as thin a gold wire as possible
Compression Shaping Minimal resin flow minimizes resin impact on chips and gold lines, resulting in higher product productivity and lower costs.
Compatible with large substrates and wafers
In order to reduce the cost of semiconductor devices, the industry is pushing forward with large-size frames and demands for the corresponding semiconductor manufacturing equipment. The Company has implemented the encapsulation of very large substrates by using compression forming technology and is the first to provide the industry with an effective solution to reduce costs.
Use chip placement down
The development of ultra-thin semiconductor devices, the same large area of the substrate and the wafer required a total of uniform resin, the chip-down due to the Company’s technology can achieve ultra-thin packaging products. Chip down can effectively reduce the occurrence of wrapping.
Reduce the process and no need to clear mode
As a result of encapsulation, there is no need for lapping of the cover and CPM (Chemical Polishing Mechanical ), which can shorten the production time of the entire manufacturing process. At the same time, there is no need for a clear mold due to the use of a release film for mold release.